Advancements in satellite technologies are increasing the power density of electronics and payloads. When the power consumption increases within a limited volume, waste heat generation also increases and this necessitates a proper and efficient thermal management system. Mostly, micro and nanosatellites use passive thermal control methods because of the low cost, no additional power requirement, ease of implementation, and better thermal performance. Passive methods lack the ability to meet certain thermal requirements on larger and smaller satellite platforms. This work numerically studies the performance of some of the passive thermal control techniques such as thermal straps, surface coatings, multi-layer insulation (MLI), and radiators for a 6U small satellite configuration carrying a mid-wave infrared (MWIR) payload whose temperature needs to be cooled down to 100K. Infrared (IR) imagers require low temperature, and the level of cooling is entirely dependent on the infrared wavelengths. These instruments are used for various applications including Earth observations, defence, and imaging at IR wavelengths. To achieve these low temperatures on such instruments, a micro-cryocooler is considered in this study. Most of the higher heat dissipating elements in the satellite are mounted to a heat exchanger plate, which is thermally coupled to an external radiator using thermal straps and heat pipes. The effects of the radiator size, orbital inclinations, space environments, satellite attitude with respect to the sun, and surface coatings are discussed elaborately for a 6U satellite configuration.

Publication: applsci-12-02858.pdf

Source: Applied Sciences, 2022, 12(6), 2858

Author: Shanmugasundaram Selvadurai, Amal Chandran, David Valentini, and Bret Lamprecht

Year: 2022

Content Tags: mli, multi-layer insulation, surface elements, surface coating a mesh, radiator, phase change material, thermocouples, finite element, finite elements, convergence, material properties, properties, CCHP

Automated design space exploration was implemented and demonstrated in the form of the multidisciplinary optimization of the design of a space-based telescope.

Off-the-shelf software representing the industry standards for thermal, structural, and optical analysis were employed. The integrated thermal/structural/optical models were collected and tasked with finding an optimum design using yet another off-the-shelf program. Using this integrated tool, the minimum mass thermal/structural design was found that directly satisfied optical performance requirements without relying on derived requirements such as isothermality and mechanical stability. Overdesign was therefore avoided, and engineering productivity was greatly improved.

This ambitious project was intended to be a pathfinder for integrated design activities. Therefore, difficulties and lessons learned are presented, along with recommendations for future investigations.

Publication: optiOpt-ICES2002b.pdf

Source: ICES

Author: B. Cullimore, T. Panczak, J. Baumann

Year: 2002

Content Tags: concurrent engineering, design optimization, parametric, robust design, design variables

This study explores the capability of Thermal Desktop to map temperatures from a thermal model to a Nastran model to evalautate thermal stress and distortion

Publication: bell_thermoelastic.pps

Source: Aerospace Thermal Control Workshop

Author: William Bell & Paul-W. Young

Year: 2005

Content Tags: chilldown, thermal stress, third-party software, convection heat transfer, walls, heat flux, convergence, temperature map, temperature mapping, finite element, finite elements, material properties, heat pipe, heatpipe, pipes

Thermal Desktop has the capability of modeling free molecular heat transfer (FMHT), but limitations are observed when working with large models during transient operation. To overcome this limitation, a MatLab program was developed that processes the Thermal Desktop free molecular conductors. It sets up the logic and arrays for the Thermal Desktop GUI used by SINDA/FLUINT. The theory of free molecular heating is presented along with the process required to setup the conductors, arrays, logic and Fortran subroutines for FMHT modeling in Thermal Desktop.

Publication: TFAWS07-1013.pdf

Source: TFAWS

Author: Eric T. Malroy

Year: 2007

Content Tags: transient, third-party software, user-defined Fortran array, radiation analysis groups, surface elements, radiation, radiation calculations, case set manager, user-defined Fortran arrays (UDFAs), submodels, radks

Thankfully, the age of stand-alone fixed-input simulation tools is fading away in favor of more flexible and integrated solutions. “Concurrent engineering” once meant automating data translations between monolithic codes, but sophisticated users have demanded more native integration and more automated tools for designing, and not just evaluating point designs. Improvements in both interprocess communications technology and numerical solutions have gone a long way towards meeting those demands.

This paper describes a small slice of a larger on-going effort to satisfy current and future demands for integrated multidisciplinary tools that can be highly customized by end-users or by third parties. Specifically, the ability to integrate fully featured thermal/fluid simulations into Microsoft’s Excel™ and other software is detailed. Users are now able not only to prepare custom user interfaces, they can use these codes as portals that allow integration activities at a larger scale. Previous enabling technologies are first described, then examples and repercussions of current capabilities are presented, and finally in-progress and future technologies are listed.

Publication: COMAPI-ICES.pdf

Source: ICES

Author: B. Cullimore, S. G. Ring, J. Baumann

Year: 2004

Content Tags: parametric, parameterize, dynamic mode, dynamic SINDA, third-party software

Structural and thermal engineers currently work independently of each other using unrelated tools, models, and methods. Without the ability to rapidly exchange design data and predicted performance, the achievement of the ideals of concurrent engineering is not possible.

Thermal codes have been unable to exploit the geometric information in structural models and the CAD design database, and do not facilitate transfer of temperature data to other discipline’s analysis models. This paper discusses the key features in Thermal Desktop for supporting integrated thermal/structural analysis. Approaches to thermal modeling in an integrated analysis environment are discussed along with Thermal Desktop's data mapping algorithm for exporting temperature data on to structural model grid points.

Publication: 99es-40.pdf

Source: ICES

Author: Tim Panczak, Mark J. Welch

Year: 1999

Content Tags: structural, finite elements, finite difference, structural mesh, temperature mapping, temperature map, concurrent engineering, concurrent design, radiation calculations, CAD geometry, postprocessing, orbit, orbital heating, radiation analysis groups, Monte Carlo, ray tracing, data mapper, solver

Thermal analysis is typically performed using a point design approach, where a single model is analyzed one analysis case at a time. Changes to the system design are analyzed by updating the thermal radiation and conduction models by hand, which can become a bottleneck when attempting to adopt a concurrent engineering approach. This paper presents the parametric modeling features that have been added to Thermal DesktopTM to support concurrent engineering. The thermal model may now be characterized by a set of design variables that are easily modified to reflect system level design changes. Geometric features, optical and material properties, and orbital elements may all be specified using user-defined variables and expressions. Furthermore, these variables may be automatically modified by Thermal Desktop’s optimization capabilities in order to satisfy user-defined design goals, or for correlating thermal models to test data. By sharing the set of design variables among analysis models spanning multiple disciplines, further integrated analysis and design may be accomplished. The framework into which Thermal Desktop is embedded in order to support an integrated Thermal/Structural/Optical design, analysis, and optimization system is also presented.

Publication: 00ICES-266.pdf

Source: ICES

Author: Timothy D. Panczak, Brent A. Cullimore

Year: 2000

Content Tags: concurrent engineering, parametric, parameterize, register, registers, dynamic mode, dynamic SINDA, symbol manager, expression editor, expressions, design optimization, orbital heating, model correlation, solver, optical properties, heat pipes, symbol, variables, case set manager, properties, structural

Publication: 17th_EWTES_MOLINA_FREQUENCYDOMAIN.pdf

Source: 17th Workshop on Thermal and ECLS Software-ESTEC

Author: Marco Molina, Christian Vettore

Year: 2003

Content Tags: third-party software, radks, heating rates