Productivity bottlenecks for integrated thermal, structural, and optical design activities were identified and systematically eliminated, making possible automated exchange of design information between different engineering specialties.

Over the past 15 years, the industry standard tool for thermal analysis, SINDA, has been expanded to include advanced thermodynamic and hydrodynamic solutions (“FLUINT”). With the recent culmination of the unique modeling tools, SINDA/ FLUINT has arguably become the most complete general-purpose thermohydraulic network analyzer that is available.

This paper describes a new means of analyzing the thermal response of air-cooled and liquid-cooled electronics that overcomes limitations in available tools and current design methods. It also shows how these new tools and methods can extend the reach of such thermal/fluid analyses by helping to size and locate components as well as dealing with both pre-test uncertainties and post-deployment variations in manufacturing, environment, and usage.

Modeling lessons learned form Ford, Visteon, GM, Delpi, Danfoss, etc.

Active cooling technologies such as heat pipes, loop heat pipes (LHPs), thermosyphons, loop thermosyphons (LTSs), and pumped single- or two-phase coolant loops require specialized modeling treatment. However, these 1D ducted systems are largely overlooked in 3D thermal modeling tools. The increasing popularity of CFD and FEM models and generation of analysis data from 3D CAD data are strong trends in the thermal analysis community, but most software answering such demands has not provided linear modeling elements appropriate for the simulation of heat pipes and coolant loops.

Structural and thermal engineers currently work independently of each other using unrelated tools, models, and methods. Without the ability to rapidly exchange design data and predicted performance, the achievement of the ideals of concurrent engineering is not possible.

Thermal engineering has long been left out of the concurrent engineering environment dominated by CAD (computer aided design) and FEM (finite element method) software.  Current tools attempt to force the thermal design process into an environment primarily created to support structural analysis, which results in inappropriate thermal models. As a result, many thermal engineers either build models “by hand” or use geometric user interfaces that are separate from and have little useful connection, if any, to CAD and FEM systems.