Productivity bottlenecks for integrated thermal, structural, and optical design activities were identified and systematically eliminated, making possible automated exchange of design information between different engineering specialties.

The problems with prior approaches are summarized, then the implementation of the corresponding solutions is documented. Although the goal of this project was the automated evaluation of coupled thermal/optical/structural designs, significant process improvements were achieved for subset activities such as stand-alone thermal, thermal/ structural, and structural/optical design analysis.

Publication: optiOpt-ICES2002a.pdf

Source: Semi-Therm

Author: B. Cullimore, T. Panczak, J. Baumann, Dr. Victor Genberg, Mark Kahan

Year: 2002

Content Tags: finite element, finite elements, finite difference, parametric, conductance, contact conductance, design optimization, robust design, optical, registers, radiation, dynamic SINDA, dynamic mode

Automated design space exploration was implemented and demonstrated in the form of the multidisciplinary optimization of the design of a space-based telescope.

Off-the-shelf software representing the industry standards for thermal, structural, and optical analysis were employed. The integrated thermal/structural/optical models were collected and tasked with finding an optimum design using yet another off-the-shelf program. Using this integrated tool, the minimum mass thermal/structural design was found that directly satisfied optical performance requirements without relying on derived requirements such as isothermality and mechanical stability. Overdesign was therefore avoided, and engineering productivity was greatly improved.

This ambitious project was intended to be a pathfinder for integrated design activities. Therefore, difficulties and lessons learned are presented, along with recommendations for future investigations.

Publication: optiOpt-ICES2002b.pdf

Source: ICES

Author: B. Cullimore, T. Panczak, J. Baumann

Year: 2002

Content Tags: concurrent engineering, design optimization, parametric, robust design, design variables

This study explores the capability of Thermal Desktop to map temperatures from a thermal model to a Nastran model to evalautate thermal stress and distortion

Publication: bell_thermoelastic.pps

Source: Aerospace Thermal Control Workshop

Author: William Bell & Paul-W. Young

Year: 2005

Content Tags: chilldown, thermal stress, third-party software, convection heat transfer, walls, heat flux, convergence, temperature map, temperature mapping, finite element, finite elements, material properties, heat pipe, heatpipe, pipes

This study explores JWST thermal and structural testing issues and possible solutions, as presented to NASA in June 2004

Publication: bell_telescope.pps

Source: Aerospace Thermal Control Workshop 2005

Author: William Bell, Frank Kudirka, & Paul-W. Young

Year: 2005

Content Tags: chilldown, refrigeration cycle, convection heat transfer, insulation, radiation, flow regime mapping, radiation analysis groups

Thermal Desktop has the capability of modeling free molecular heat transfer (FMHT), but limitations are observed when working with large models during transient operation. To overcome this limitation, a MatLab program was developed that processes the Thermal Desktop free molecular conductors. It sets up the logic and arrays for the Thermal Desktop GUI used by SINDA/FLUINT. The theory of free molecular heating is presented along with the process required to setup the conductors, arrays, logic and Fortran subroutines for FMHT modeling in Thermal Desktop.

Publication: TFAWS07-1013.pdf

Source: TFAWS

Author: Eric T. Malroy

Year: 2007

Content Tags: transient, third-party software, user-defined Fortran array, radiation analysis groups, surface elements, radiation, radiation calculations, case set manager, user-defined Fortran arrays (UDFAs), submodels, radks

Thankfully, the age of stand-alone fixed-input simulation tools is fading away in favor of more flexible and integrated solutions. “Concurrent engineering” once meant automating data translations between monolithic codes, but sophisticated users have demanded more native integration and more automated tools for designing, and not just evaluating point designs. Improvements in both interprocess communications technology and numerical solutions have gone a long way towards meeting those demands.

This paper describes a small slice of a larger on-going effort to satisfy current and future demands for integrated multidisciplinary tools that can be highly customized by end-users or by third parties. Specifically, the ability to integrate fully featured thermal/fluid simulations into Microsoft’s Excel™ and other software is detailed. Users are now able not only to prepare custom user interfaces, they can use these codes as portals that allow integration activities at a larger scale. Previous enabling technologies are first described, then examples and repercussions of current capabilities are presented, and finally in-progress and future technologies are listed.

Publication: COMAPI-ICES.pdf

Source: ICES

Author: B. Cullimore, S. G. Ring, J. Baumann

Year: 2004

Content Tags: parametric, parameterize, dynamic mode, dynamic SINDA, third-party software

Structural and thermal engineers currently work independently of each other using unrelated tools, models, and methods. Without the ability to rapidly exchange design data and predicted performance, the achievement of the ideals of concurrent engineering is not possible.

Thermal codes have been unable to exploit the geometric information in structural models and the CAD design database, and do not facilitate transfer of temperature data to other discipline’s analysis models. This paper discusses the key features in Thermal Desktop for supporting integrated thermal/structural analysis. Approaches to thermal modeling in an integrated analysis environment are discussed along with Thermal Desktop's data mapping algorithm for exporting temperature data on to structural model grid points.

Publication: 99es-40.pdf

Source: ICES

Author: Tim Panczak, Mark J. Welch

Year: 1999

Content Tags: structural, finite elements, finite difference, structural mesh, temperature mapping, temperature map, concurrent engineering, concurrent design, radiation calculations, CAD geometry, postprocessing, orbit, orbital heating, radiation analysis groups, Monte Carlo, ray tracing, data mapper, solver

Thermal analysis is typically executed with multiple tools in a series of separate steps for performing radiation analysis, generating conduction and capacitance data, and for solving temperatures. This multitude of programs often leads to many user files that become unmanageable with their multitude, and the user often looses track as to which files go with which cases. In addition to combining the output from multiple programs, current processes often involve the user inputting various hand calculations into the math model to account for MLI/Insulation and contact conductance between entities. These calculations are not only tedious to make, but users often forget to update them when the geometry is changed.

Several new features of Thermal Desktop are designed to automate some of the tedious tasks that thermal engineers now practice. To start with, Thermal Desktop is a single program that does radiation analysis, generates conduction/capacitance data and automates the building of a SINDA/FLUINT model to solve for temperatures. Some of these new features of Thermal Desktop are Radiation Analysis Groups, Property Aliases, MLI/Insulation Objects, Contact Conductance Objects, Model Browser, and the Case Set Manager.

This paper describes the application and benefits of Thermal Desktop along with other unique features used to automate the thermal analysis process.

Publication: tDesktop99.pdf

Source: ICES

Author: Mark J. Welch, Tim Panczak

Year: 1999

Content Tags: radiation analysis groups, property, alias, multi-layer insulation, mli, insulation, contact conductance, model browser, case set manager

Thermal analysis is typically performed using a point design approach, where a single model is analyzed one analysis case at a time. Changes to the system design are analyzed by updating the thermal radiation and conduction models by hand, which can become a bottleneck when attempting to adopt a concurrent engineering approach. This paper presents the parametric modeling features that have been added to Thermal DesktopTM to support concurrent engineering. The thermal model may now be characterized by a set of design variables that are easily modified to reflect system level design changes. Geometric features, optical and material properties, and orbital elements may all be specified using user-defined variables and expressions. Furthermore, these variables may be automatically modified by Thermal Desktop’s optimization capabilities in order to satisfy user-defined design goals, or for correlating thermal models to test data. By sharing the set of design variables among analysis models spanning multiple disciplines, further integrated analysis and design may be accomplished. The framework into which Thermal Desktop is embedded in order to support an integrated Thermal/Structural/Optical design, analysis, and optimization system is also presented.

Publication: 00ICES-266.pdf

Source: ICES

Author: Timothy D. Panczak, Brent A. Cullimore

Year: 2000

Content Tags: concurrent engineering, parametric, parameterize, register, registers, dynamic mode, dynamic SINDA, symbol manager, expression editor, expressions, design optimization, orbital heating, model correlation, solver, optical properties, heat pipes, symbol, variables, case set manager, properties, structural