This page provides a filter system to help users find publication files in our library. Clicking on any title in the list will expand the view, displaying a description, link, and keyword tags.
Use the filters on the left to narrow the list based on what you are interested in. Additionally you can use the keyword search field below to search on tags, titles, and content. Note that clicking on a tag under a title will also search for other similarly tagged items on our site such as recorded videos.
Free Molecular Heat Transfer Programs for Setup and Dynamic Updating the Conductors in Thermal Desktop
Thermal Desktop has the capability of modeling free molecular heat transfer (FMHT), but limitations are observed when working with large models during transient operation. To overcome this limitation, a MatLab program was developed that processes the Thermal Desktop free molecular conductors. It sets up the logic and arrays for the Thermal Desktop GUI used by SINDA/FLUINT. The theory of free molecular heating is presented along with the process required to setup the conductors, arrays, logic and Fortran subroutines for FMHT modeling in Thermal Desktop.
Author: Eric T. Malroy
Content Tags: transient, third-party software, user-defined Fortran array, radiation analysis groups, surface elements, radiation, radiation calculations, case set manager, user-defined Fortran arrays (UDFAs), submodels, radks
Collaborative design and analysis of Electro-Optical sensors
Complex products are best developed in a collaborative design environment where engineering data and CAD/CAE results can be shared across engineering discipline boundaries within a common software interface. A new software tool that allows Electro-Optical (EO) sensors to be developed in this manner has been used to conduct an integrated Structural/Thermal/Optical (STOP) analysis of a critical lens subassembly in a flight payload. This paper provides a description of the software environment and a summary of the technical results that were produced with it.
Source: The Aerospace Corporation
Author: Jason Geis, Jeff Lang, Leslie Peterson, Francisco Roybal, David Thomas
Content Tags: concurrent engineering, concurrent design, third-party software, mesh, finite element, mashing, parametric, material properties, optical properties, boundary conditions, conductance, structural, thermocouples, transient
Optimization, Data Correlation, and Parametric Analysis Features in SINDA/FLUINT Version 4.0
This paper describes revolutionary advances in SINDA/FLUINT, the NASA-standard heat transfer and fluid flow analyzer, changing it from a traditional point-design simulator into a tool that can help shape preliminary designs, rapidly perform parametrics and sensitivity studies, and even correlate modeling uncertainties using available test data.
Innovations include the incorporation of a complete spreadsheet-like module that allows users to centralize and automate model changes, even while thermal/fluid solutions are in progress. This feature reduces training time by eliminating many archaic options, and encourages the performance of parametrics and other what-if analyses that help engineers develop an intuitive understanding of their designs and how they are modeled.
The more revolutionary enhancement, though, is the complete integration of a nonlinear programming module that enables users to perform formal design optimization tasks such as weight minimization or performance maximization. The user can select any number of design variables and may apply any number of arbitrarily complex constraints to the optimization. This capability also can be used to find the best fit to available test data, automating a laborious but important task: the correlation of modeling uncertainties such as optical properties, contact conductances, as-built insulation performance, natural convection coefficients, etc.
Finally, this paper presents an overview of related developments that, coupled with the optimization capabilities, further enhance the power of the whole package.
Source: ICES 1998
Author: Brent A. Cullimore
Content Tags: design optimization, model correlation, parameterize, parametric, two-phase flow, two-phase, optical properties, submodels, registers, expression editor, user logic, concurrent engineering, concurrent design, dynamic mode, dynamic SINDA, specific heat, solver, constraint, slip flow, Phenomena, capillary systems, mixtures, working fluids, nonequilibrium, vapor compression, uncertainty, uncertainty analysis
Reliability Engineering and Robust Design: New Methods for Thermal/Fluid Engineering
Recent years have witnessed more improvement to the SINDA/FLUINT thermohydraulic analyzer than at any other time in its long history. These improvements have included not only expansions in analytic power, but also the additions of high-level modules that offer revolutions in thermal/ fluid engineering itself.
One such high-level module, “Reliability Engineering,” is described in this paper. Reliability Engineering means considering tolerances in design parameters, uncertainties in environments, uncertainties in application (e.g. usage scenarios), and variations in manufacturing as the stochastic phenomena that they are. Using this approach, the probability that a design will achieve its required performance (i.e., the reliability) is calculated, providing an assessment of risk or confidence in the design, and quantifying the amount of over- or under-design present.
The design to be evaluated for reliability will likely have been produced using traditional methods. Possibly, the design was generated using the Solver optimizer, another high-level module available in SINDA/FLUINT. Using design optimization, the user quantifies the goals that make one design better than another (mass, efficiency, etc.), and specifies the thresholds or requirements which render a given design viable or useless (exceeding a performance limit, etc.). SINDA/FLUINT then automatically searches for an optimal design.
Robust Design means factoring reliability into the development of the design itself: designing for a target reliability and thereby avoiding either costly over-design or dangerous under-design in the first place. Such an approach eliminates a deterministic stack-up of tolerances, worst-case scenarios, safety factors, and margins that have been the traditional approaches for treating uncertainties.
In any real system or product, heat transfer and fluid flow play a limited role: there are many other aspects to a successful design than the realm of thermal/fluids that is encompassed by SINDA/FLUINT. Therefore, this paper concludes with brief descriptions of methods for performing interdisciplinary design tasks.
Source: CRTech White Paper
Author: Brent A. Cullimore
Content Tags: design optimization, reliability engineering, robust design, constraints, boundary conditions, concurrent design, concurrent engineering, batteries, flow control, orifices, radiator, registers, two-phase flow, solver, model correlation, dynamic SINDA, dynamic mode, variables, Monte Carlo, material properties, third-party software, uncertainty analysis, uncertainty
Beyond Point Design Evaluation
Customizable Multidiscipline Environments for Heat Transfer and Fluid Flow Modeling
Thankfully, the age of stand-alone fixed-input simulation tools is fading away in favor of more flexible and integrated solutions. “Concurrent engineering” once meant automating data translations between monolithic codes, but sophisticated users have demanded more native integration and more automated tools for designing, and not just evaluating point designs. Improvements in both interprocess communications technology and numerical solutions have gone a long way towards meeting those demands.
This paper describes a small slice of a larger on-going effort to satisfy current and future demands for integrated multidisciplinary tools that can be highly customized by end-users or by third parties. Specifically, the ability to integrate fully featured thermal/fluid simulations into Microsoft’s Excel™ and other software is detailed. Users are now able not only to prepare custom user interfaces, they can use these codes as portals that allow integration activities at a larger scale. Previous enabling technologies are first described, then examples and repercussions of current capabilities are presented, and finally in-progress and future technologies are listed.
Author: B. Cullimore, S. G. Ring, J. Baumann
Automating Thermal Analysis with Thermal Desktop
Thermal analysis is typically executed with multiple tools in a series of separate steps for performing radiation analysis, generating conduction and capacitance data, and for solving temperatures. This multitude of programs often leads to many user files that become unmanageable with their multitude, and the user often looses track as to which files go with which cases. In addition to combining the output from multiple programs, current processes often involve the user inputting various hand calculations into the math model to account for MLI/Insulation and contact conductance between entities. These calculations are not only tedious to make, but users often forget to update them when the geometry is changed.
Several new features of Thermal Desktop are designed to automate some of the tedious tasks that thermal engineers now practice. To start with, Thermal Desktop is a single program that does radiation analysis, generates conduction/capacitance data and automates the building of a SINDA/FLUINT model to solve for temperatures. Some of these new features of Thermal Desktop are Radiation Analysis Groups, Property Aliases, MLI/Insulation Objects, Contact Conductance Objects, Model Browser, and the Case Set Manager.
This paper describes the application and benefits of Thermal Desktop along with other unique features used to automate the thermal analysis process.
Author: Mark J. Welch, Tim Panczak
Parametric Thermal Analysis and Optimization Using Thermal Desktop
Thermal analysis is typically performed using a point design approach, where a single model is analyzed one analysis case at a time. Changes to the system design are analyzed by updating the thermal radiation and conduction models by hand, which can become a bottleneck when attempting to adopt a concurrent engineering approach. This paper presents the parametric modeling features that have been added to Thermal DesktopTM to support concurrent engineering. The thermal model may now be characterized by a set of design variables that are easily modified to reflect system level design changes. Geometric features, optical and material properties, and orbital elements may all be specified using user-defined variables and expressions. Furthermore, these variables may be automatically modified by Thermal Desktop’s optimization capabilities in order to satisfy user-defined design goals, or for correlating thermal models to test data. By sharing the set of design variables among analysis models spanning multiple disciplines, further integrated analysis and design may be accomplished. The framework into which Thermal Desktop is embedded in order to support an integrated Thermal/Structural/Optical design, analysis, and optimization system is also presented.
Author: Timothy D. Panczak, Brent A. Cullimore
Content Tags: concurrent engineering, parametric, parameterize, register, registers, dynamic mode, dynamic SINDA, symbol manager, expression editor, expressions, design optimization, orbital heating, model correlation, solver, optical properties, heat pipes, symbol, variables, case set manager, properties, structural