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Free Molecular Heat Transfer Programs for Setup and Dynamic Updating the Conductors in Thermal Desktop

Thermal Desktop has the capability of modeling free molecular heat transfer (FMHT), but limitations are observed when working with large models during transient operation. To overcome this limitation, a MatLab program was developed that processes the Thermal Desktop free molecular conductors. It sets up the logic and arrays for the Thermal Desktop GUI used by SINDA/FLUINT. The theory of free molecular heating is presented along with the process required to setup the conductors, arrays, logic and Fortran subroutines for FMHT modeling in Thermal Desktop.

Publication: TFAWS07-1013.pdf

Source: TFAWS

Author: Eric T. Malroy

Year: 2007

Content Tags: transient, third-party software, user-defined Fortran array, radiation analysis groups, surface elements, radiation, radiation calculations, case set manager, user-defined Fortran arrays (UDFAs), submodels, radks

Optimization, Data Correlation, and Parametric Analysis Features in SINDA/FLUINT Version 4.0

This paper describes revolutionary advances in SINDA/FLUINT, the NASA-standard heat transfer and fluid flow analyzer, changing it from a traditional point-design simulator into a tool that can help shape preliminary designs, rapidly perform parametrics and sensitivity studies, and even correlate modeling uncertainties using available test data.

Innovations include the incorporation of a complete spreadsheet-like module that allows users to centralize and automate model changes, even while thermal/fluid solutions are in progress. This feature reduces training time by eliminating many archaic options, and encourages the performance of parametrics and other what-if analyses that help engineers develop an intuitive understanding of their designs and how they are modeled.

The more revolutionary enhancement, though, is the complete integration of a nonlinear programming module that enables users to perform formal design optimization tasks such as weight minimization or performance maximization. The user can select any number of design variables and may apply any number of arbitrarily complex constraints to the optimization. This capability also can be used to find the best fit to available test data, automating a laborious but important task: the correlation of modeling uncertainties such as optical properties, contact conductances, as-built insulation performance, natural convection coefficients, etc.

Finally, this paper presents an overview of related developments that, coupled with the optimization capabilities, further enhance the power of the whole package.

Publication: sf981574.pdf

Source: ICES 1998

Author: Brent A. Cullimore

Year: 1998

Content Tags: design optimization, model correlation, parameterize, parametric, two-phase flow, two-phase, optical properties, submodels, registers, expression editor, user logic, concurrent engineering, concurrent design, dynamic mode, dynamic SINDA, specific heat, solver, constraint, slip flow, Phenomena, capillary systems, mixtures, working fluids, nonequilibrium, vapor compression, uncertainty, uncertainty analysis

Highlights in thermal engineering at Carlo Gavazzi Space


Source: 17th Workshop on Thermal and ECLS Software-ESTEC

Author: Marco Molina, Christian Vettore

Year: 2003

Content Tags: third-party software, radks, heating rates

A CAD-based Tool for FDM and FEM Radiation and Conduction Modeling

Thermal engineering has long been left out of the concurrent engineering environment dominated by CAD (computer aided design) and FEM (finite element method) software.  Current tools attempt to force the thermal design process into an environment primarily created to support structural analysis, which results in inappropriate thermal models. As a result, many thermal engineers either build models “by hand” or use geometric user interfaces that are separate from and have little useful connection, if any, to CAD and FEM systems.

This paper describes the development of a new thermal design environment called the Thermal Desktop. This system, while fully integrated into a neutral, low-cost CAD system, and which utilizes both FEM and FD methods, does not compromise the needs of the thermal engineer. Rather, the features needed for concurrent thermal analysis are specifically addressed by combining traditional parametric surface-based radiation and FD based conduction modeling with CAD and FEM methods. The use of flexible and familiar temperature solvers such as SINDA/FLUINT is retained.

Publication: ices-98es-51.pdf

Source: ASME

Author: Tim Panczak, Steve Ring, Mark Welch

Year: 1997

Content Tags: finite element, finite difference, concurrent engineering, heater, heatpipe, heat pipe, radiation analysis groups, optical properties, Phenomena, refraction, scaffolding, CAD geometry, layers, expression editor, solver, mesh, mesher, structural mesh, ray tracing, boundary conditions, thermal stress, radiator, conductance, batteries, orbital heating, mli, multi-layer insulation, radks, articulation, articulating