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Thermal Modeling Software Using FEM, FD and FNM Methods

Thermal Desktop® is a PC based design environment for generating thermal models of electronics and vehicles. Using Thermal Desktop, engineers can use CAD drawings either directly as a thermal model, or indirectly as scaffolding for fast "snap on" attachment of Thermal Desktop elements, surfaces, and solids. Thermal Desktop is a graphical user interface (GUI) for SINDA/FLUINT.

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Product Overview

Thermal Desktop is a PC based design environment for generating thermal models of electronics and vehicles. Using Thermal Desktop, engineers can use CAD drawings either directly as a thermal model, or indirectly as scaffolding for fast "snap on" attachment of Thermal Desktop elements, surfaces, and solids. Thermal Desktop incorporates both familiar parameter based (TRASYS like) finite difference surfaces with finite elements with CAD technology to model thermal problems. Thermal Desktop develops the capacitance and conductance network for input to SINDA/FLUINT. Thermal Desktop has thermal analysis specific type of capabilities such as applying contact conductance, insulation, heat loads, and heaters. Thermal Desktop provides full design parameterization using spreadsheet-like variables and arbitrarily complex expressions as input, rather than hardwired numbers. This allows complex models to be rapidly manipulated using a few keystrokes, meaning that updating or maintaining a model is trivially easy, as is performing sensitivity studies and investigating what-if scenarios. This provides access to SINDA/FLUINT's Optimization and Reliability Engineering modules, which can be used to size components, maximize performance, find worst-case operating conditions (design cases), correlate models to test data, and even treat uncertainties statistically.Thermal Desktop is available for PC as an AutoCAD extension module. Autocad Invertor Suite is available bundled with Thermal Desktop from C&R Technologies. The following add-on modules are available to expand the capabilities of Thermal Desktop:

  • RadCAD® is an optional thermal radiation analysis module for high temperature and/or vacuum applications.
  • FloCAD® adds the capability of modeling flow circuits, including fans and convective heat transfer, attached directly to the surfaces and solids.
More Information
Thermal Desktop Features
  • Thermophysical property database
  • Constant and temperature dependent capacitance and conductivity
  • Supports anisotropic thermal conductivity
  • Ability to work in any user desired units
  • Finite difference conic surfaces such as cones, cylinders, rectangles, spheres, paraboloids, polygons, ellipsoid, elliptic cone, elliptic cylinder, and offset paraboloid
  • Finite difference solids such as bricks, cylinders, and spheres
  • Finite elements - triangle, quadrilateral, tetrahedron, wedge, and bricks
  • Edge node conics to span entire geometry of cones, cylinders, rectangles, spheres, or paraboloids
  • Built-in mesher allows creation of finite elements based on AutoCAD surfaces, regions, or solids.
  • Case Set Manager to take the model from geometric definition to temperatures with the click of a button without the user ever entering an editor
  • Model browser that allows the user to easily locate nodes and the properties of them
  • Complete geometrical post processing of thermal data - temperature, capacitance, heating rates, etc & as well as generic ASCII input
  • Fully integrated with the EZ-XY® Plotting Utility
  • Arbitrary nodes and conductors, including area based conductors to model convection
  • Surface Insulation objects for modeling Multi Layered Insulation (MLI), foam type insulators, or ablative materials
  • Heater Objects
  • Super Nodes and Super Networks
  • Automatic calculation of contact conductance between non aligned surfaces/edges
  • Integration with SINDA/FLUINT including the Advanced Design Module
  • Thermal mapping tools to map temperatures back to NASTRAN, FEMAP, ANSYS or I-deas
  • Boundary Condition mapping of time- and temperature-dependent heat fluxes from CFD results to Thermal Desktop
  • Traditional finite element functions such as showing free edges, merging coincident nodes, hiding interior solid faces, and surface coating capabilities
  • Conductors from a single node to multiple surfaces has been added to facilitate convection modeling
  • Network Element Logic
  • 64-bit calculations and multi-processor support
  • Tools to facilitate making movies (avi files) for post processing and viewing the spacecraft in orbit
  • Thermoelectric Cooling Devices
  • Extensive user comment capabilities for model documentation
  • Built in natural convection correlations
CAD Model Building Technology
  • Snap on model building
  • Drag and Drop model editing
  • Wireframe, hidden, and rendered views
  • Boolean Surfaces
  • Revolved Surfaces
  • Extruded Surfaces
  • Mirrored Surfaces
  • Scaling
  • Layer Management
  • Multiple independent port views
  • User defined light sources
Import and Export Capabilities
  • TRASYS import and export
  • Nevada import
  • IDEAS FE and FD import
  • FEMAP import
  • NASTRAN import
  • ANSYS import
  • NASTRAN and ANSYS temperature mapping export
  • NASTRAN mesh export
  • TSS import and export
  • IGES (only with Autocad Inventor)
  • STEP (only with Autocad Mechanical or Inventor)
  • STEP-204 (only with Autocad Mechanical or Inventor)
  • STEP-209 import and export
  • STEP-TAS import and export
  • Iceboard import for printed circuit board design
  • SAT/ACIS import

Minimum System Requirements

  • XP Pro (SP2 or newer), Vista Pro or Home, Windows 7
  • AutoCAD
    • 32 Bit Version: 2007, 2008, 2009, 2010, 2011, 2012, and 2013
    • 64 Bit Version: AutoCAD 2008, 2009, 2010, 2011, 2012, and 2013
    • Autocad 2008, 2009, and 2010 will be no longer be supported after Thermal Desktop version 5.5
  • Memory: 1 GB Minimum for XP, 2 GB for Vista or Windows 7
  • Display resolution: 1024x768 minimum, 1280x1024 or finer with 100% font size recommended




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